An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip

being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to

complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.